izmo Ltd
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SEMICONDUCTOR PACKAGING

Advanced Semiconductor
Packaging & Engineering

Redefining innovation with advanced SiP solutions, silicon photonics, and India-based 3D infrastructure – from concept to commercialization.

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3D
DIE
STACKING
 
C1000
CLEANROOM
FACILITY
 
6
GLOBAL
LOCATIONS
 
30 Years 30 Yrs
IN
OPERATIONS

OVERVIEW

Pioneering Advanced Semiconductor Packaging in India

Powering the technologies of tomorrow, our semiconductor capabilities span advanced System-in-Package (SiP) design and manufacturing, cutting-edge silicon photonics, and tailored industry solutions.

From high-performance ASIC design to efficient power integration and precision radio frequency and microwave assemblies, we bring together innovation, scalability, and reliability to solve complex engineering challenges and accelerate next-generation product development across industries.

A division of the BSE & NSE listed izmo limited, izmomicro is shaping the future
of semiconductor packaging in India with precision engineering, silicon photonics innovation,
and world-class manufacturing infrastructure.

Deep Tech Innovation

Silicon photonics and co-packaged optics

India-First Manufacturing

Bengaluru HQ with Class 1000 cleanroom

IP-Secured by Design

SiP architecture with built-in IP protection

Global Footprint

India, US, UK, Germany, Belgium, France

IIT Logo CPPICSIIT Madras
+
izmomicro

Advancing Next-Generation Photonic Processors

izmomicro - a subsidiary of izmo Ltd., specializing in semiconductors, is the exclusive industry partner in the IIT Madras Photonic Chip Packaging Initiative. The partnership focuses on developing next-generation programmable photonic processors (FPPGA), advancing photonic integration for quantum and AI-driven applications, and driving innovative silicon photonics solutions for high-speed telecom and computing technologies.

CORE CAPABILITIES

From Concept to Commercialization

Our services span the entire product lifecycle - enabling rapid innovation and reliable deployment.

01 — DESIGN

Design & Simulation

Use advanced simulation tools and deep domain expertise to design high-performance photonic solutions and SiPs optimized for performance and reliability from the outset.

02 — VALIDATION

Testing & Packaging

Deliver advanced photonic packaging and SiPs supported by rigorous testing to ensure compliance and meet specific application requirements.

03 — PRODUCTION

Manufacturing

Enable flexible, scalable manufacturing - from low-volume research builds to full-scale commercial production.

CAPABILITIES

Semiconductor Solutions Across Sectors

01

IC Packaging & SiP

Advanced System-in-Package and Multi-Chip Module assembly for high-density, high-performance industrial and aerospace applications.

02

Silicon Photonics

Complete photonic lifecycle - design, simulation, testing, packaging, and manufacturing for advanced optical interconnects.

03

RF & MW Assemblies

High-intensity Radio Frequency and Microwave assemblies for defense, telecom, and industrial applications.

04

ASIC

Tailored solutions enabling fabless ASIC design firms to achieve optimized performance, power efficiency, and form factor.

05

Power Integration

Advanced power module packaging for automotive, industrial, renewable energy, and high-reliability markets.

06

Co-packaged Optics

Cutting-edge optical solutions integrating photonic and electronic chips for ultra-high-bandwidth data center and AI infrastructure.

INDUSTRIES WE SERVE

Manufacturing
Automotive
Medical
Telecom
IoT
Aerospace

Advanced Manufacturing Expertise

Manufacturing excellence with SiP and SMT solutions, delivered from our state-of-the-art cleanroom in Whitefield, Bangalore.

High-Precision Capabilities

High-precision packaging powered by advanced assembly, bonding, molding, and hybrid substrate technologies.

Industry-Grade Quality

SiP and MCM assemblies designed to meet stringent requirements of high-tech industrial and aerospace applications.

BREAKTHROUGH

High-Power Motor Control
Technology

IN-HOUSE R&D

With Prestigious DSIR
Recognition

84%

Footprint Reduction in Space-Grade
Packaging

PARTNERSHIP

izmo Ltd × IIT Madras for Photonic
Chip Packaging

SIP DESIGN & MANUFACTURING

Advanced Packaging for Mission-Critical Applications

At izmo, we deliver advanced System-in-Package (SiP) solutions with end-to-end semiconductor packaging and manufacturing capabilities. From substrate design to full-scale production, we support every stage of the product lifecycle - engineering samples, prototyping, pilot runs, qualification, and high-volume manufacturing.

WHY PARTNER WITH US

Multidisciplinary Expertise Backed by Infrastructure

Partnering with izmo gives you access to multidisciplinary expertise backed by specialized skills and advanced tools that address thermal management, electrical interference, and rigorous testing to minimize design risks.

Advanced Packaging
Technologies

Flip chip, wire bonding, and wafer-level packaging for robust, high-performance SiP delivery.

Cross-Industry
Experience

Commercial, automotive, aerospace/defense, and telecom sectors with proven credibility.

Certified
Infrastructure

ISO 9001:2015 standards ensuring high-quality, cost-efficient manufacturing.

End-to-End
Support

From engineering samples to high-volume manufacturing across the full product lifecycle.

ENGINEERING APPROACH

A Three-Pronged Approach to Industry-Ready Solutions

TECH
  • Flip chip
  • 3D packaging
  • MEMS packaging
  • Thin die and brittle die
  • Hermetic sealing
  • Optical assembly
DESIGN
  • Package design - organic, LTCC, HTCC, thermally enhanced
  • SI & PI analysis
  • Thermal and thermo-mechanical analysis
  • EMI/EMC analysis
PRODUCT
  • Packaging: QFN, BGA, PQFP, CQFP, DIP, Metal Can, COB
  • MCM
  • System-in-Package
  • Thick film hybrid microcircuits
  • Thin film hybrid circuits
  • RF and microwave modules

SILICON PHOTONICS

The Rising Wave of Silicon Photonics

Silicon photonics is revolutionizing high-speed data transmission, AI computing, and next-gen communication networks. At izmo, we provide world-class silicon photonics packaging, assembly, and manufacturing solutions, addressing the critical challenges of optical alignment, thermal management, and heterogeneous integration.

KEY BUSINESS SEGMENTS FOR SILICON PHOTONICS

01

Hyperscale data centers & cloud
computing

02

Quantum computing & secure
communications

03

AI & optical computing

04

Next-gen telecommunications

05

Biomedical imaging & optical
sensing

CAPABILITIES & MANUFACTURING EXPERTISE

izmo's Silicon Photonics Packaging Ecosystem

With over a decade of experience in IC packaging and System-in-Package (SiP), izmo has developed a state-of-the-art silicon photonics packaging and manufacturing ecosystem. As India's first and only silicon photonics packaging provider, we combine advanced facilities with strong industry collaborations.

Precision Silicon Photonics Assembly & Packaging

Advanced heterogeneous SiP solutions for photonic integration. Sub-micron active alignment of fiber arrays, waveguides, and laser sources. High-speed electrical and optical interconnects with low-loss coupling techniques for efficient fiber attachment and photonic waveguide integration.

High-Performance Package Design

Effective thermal management through heat spreaders, thermoelectric cooling (TEC), and optimized material selection. Enhanced signal and power integrity for high-speed applications. 2.5D and 3D packaging with optical and RF co-packaging for high-bandwidth, low-latency performance.

Mid-Volume Silicon Photonics Manufacturing

Scalable manufacturing with fully optimized mid-volume production lines tailored for photonic devices. Custom test and validation solutions for high-yield, reliable packaging. Deep expertise in co-packaged optics for AI, cloud, and data center applications.

Exclusive Industry Collaboration with IIT Madras

izmomicro is the exclusive industry partner in the IIT Madras Photonic Chip Packaging Initiative, collaborating on next-generation programmable photonic processors (FPPGA) and advancing photonic integration for quantum and AI-driven applications.

INDUSTRY SOLUTIONS

Tailored Solutions for Every Application

From advanced IC packaging for fabless ASIC firms to high-performance power modules and precision RF assemblies — customized to align with your budget, performance goals, and size requirements.


PACKAGE PORTFOLIO

QFN
Compact, low-cost solutions for medium pin-count devices
BGA
Scalable for higher I/O counts with robust electrical and thermal properties
CSP & WLP
Ultra-small footprints for mobile and IoT markets
Flip-Chip BGA
High-performance platforms for complex, high-speed ASICs
2.5D/3D SiP
Multi-die integration for logic, memory sensors, and chiplets

ASIC SOLUTIONS

Advanced IC Packaging for Fabless Design Firms

Our advanced IC packaging services empower fabless ASIC design firms to achieve optimal performance, power efficiency, and compact form factors. Each solution is thoughtfully customized to align with a client's specific budget, performance goals, and size requirements.

Packaging-centric ASIC design
Broad package portfolio
Comprehensive testing & qualification
Concurrent co-design
Cross-industry experience

POWER INTEGRATION

High-Performance Packaging for Energy-Intensive Applications

At izmo, we deliver advanced power module packaging solutions for automotive, industrial, renewable, and high-reliability markets. Our expertise in motor control, power conversion, and energy management ensures optimized electrical performance, thermal efficiency, and scalable manufacturing.

01

Specialists in power electronics
packaging

02

Proven track record in technology
integration

03

Comprehensive development
support

04

Trusted across various sectors

05

Certified world-class infrastructure

VARIABLE SPEED DRIVE POWER MODULES

BLDC Motor Driver Modules

Compact, rugged packages designed for low conduction losses and reliable high-current handling.

 

Hex Bridge Modules

Configurable half-bridge and full-bridge topologies suitable for robotics and power tools.

 

IGBT Power Modules

High-voltage modules with enhanced reliability for demanding operating conditions.

SUBSTRATE TECHNOLOGIES
  • Direct-Bonded Copper (DBC)
  • Direct-Bonded Aluminum (DBA)
  • Active Metal Brazing (AMB)
  • Insulated Metal Substrate (IMS)
THERMAL MANAGEMENT
  • Void-free soldering with optimized fluxes
  • Double-sided cooling architecture
  • High-conductivity materials & thermal interface management
  • Lid/spreader designs for long-term operation

RF & MW ASSEMBLIES

Precision Packaging for High-Frequency Performance

Our expertise in Radio Frequency (RF) and Microwave (MW) assemblies spans a wide range of package families - from open-cavity QFN for sensitive analog and mixed-signal devices to flip-chip BGAs and complete RF modules, all customized for specific applications.

Proven RF Co-Design
Expertise
Versatile Process
Capabilities
End-to-End Engineering
Support
Cross-Industry
Experience
Certified World-Class
Infrastructure

IC Architecture for Quick-To-Market Applications

01

Open-Cavity QFN Packages

Ideal for RF front-end devices like MMICs, power amplifiers, and LNAs. Enables precision wire bonding with minimal parasitics, superior RF and thermal performance, multiple bonding materials, and high-reliability assembly.

02

Molded QFN Packages

Fully encapsulated QFN with 50Ω impedance-optimized design for reliable RF performance up to mmWave bands. Supports high-volume, cost-efficient manufacturing with flexible configurations for power and RF co-integration

03

Flip-Chip BGA (FCBGA)

High-frequency routing with short interconnects for low-loss high-bandwidth using organic/ABF substrates. Enables advanced MMIC and RF SoC integration with multi-die, high-I/O, and antenna-in-package (AiP) configurations.

04

RF Module Assembly

Compact multi-chip RF systems integrating filters, amplifiers, antennas, and passives using advanced SiP techniques. Supports diverse applications from 5G and IoT to radar and defense with flexible reliability options.

READY TO BUILD WHAT'S NEXT?

Partner with India's

Semiconductor Pioneer

Whether you need advanced SiP packaging, silicon photonics integration, or precision RF assemblies - izmo Ltd has the technology, infrastructure, and expertise to deliver.